This technology involves combining various electronic components into high-performance, multi-functional compact modules. Besides circuit design technology and packaging technology, advanced IC component embedding technology and MEMS technology are also applied.
Circuit design technology
This field comprises selecting optimum components and designing the wiring layout, and thermal protection using advanced simulation techniques.
PC board type power supply
Packaging technology
Important stages in this process are parts assembly, matching, sealing, and structural design to achieve compact dimensions and high performance.
High-frequency devices
MEMS technology
MEMS technology involves configuring sensor, actuator and similar functions on a chip to create a very compact functional device.
MEMS pressure sensor
Equipment technology
TDK provides advanced factory automation equipment to meet the needs of the industry in areas such as IC auto mounting and semiconductor fabrication.
Flip-chip mounter FOUP load port
IC embedding (Semiconductor Embedded Substrate; SESub) technology
This technology involves embedding ICs and other components as well as the wiring into the substrate itself, to achieve a modular product.
"One-segment" TV broadcast reception module