Super Eco Love

EMC Components

Multilayer Chip Beads
MMZ Series(0402 Size)

Multilayer Chip Beads MMZ0402 Series

Effective Use of Resources Volume Reduced 94% Effective Use of Resources Mounting Area Reduced 82% Effective Use of Resources Packaging Materials Reduced 50%
Energy Savings Power Consumption Reduced 50% during Transport Restricted Chemical Substances RoHS Compliant    

Applications

Mobile communications devices (prevention of radiated noise from high-speed signal lines)

These compact, low-profile, high-performance beads are used to prevent radiated noise from the high-speed signal lines of mobile communications devices that must be compact and slim such as mobile phones. TDK’s fine pattern formation and thin-film formation technologies allow these beads to be formed at the industry’s smallest size.*

* As of October, 2009, according to TDK-EPC investigations.

Main Environmental Impact Reduction Effects

  1. Smaller size and lighter weight means resource saving (volume is reduced by approximately 94% compared to the TDK MMZ1005 component).
  2. The smaller size reduces mounting area (mounting area is reduced by approximately 82% compared to the TDK MMZ1005 component), contributing to reduced solder use and smaller and lighter customer sets.
  3. Miniaturization results in less packaging material used (reduced by approximately 50% compared to the TDK MMZ1005 component). (Twice as many components can be packaged on a single reel compared to 1005 components.)
  4. Smaller size and lighter weight contributes to lower energy usage during transportation (approximately 50% lower compared to the TDK MMZ1005 component).

(Posted September 5, 2008)

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