FOUP purge system
|Energy consumption reduced by 36%||Purge gas reduced by 64%.||RoHS Compliant|
Nitrogen substitution device for use in semiconductor production processes.
By keeping wafers processed in each procedure in the pod (FOUP) and using a nitrogen atmosphere to maintain clean conditions, the concentration of oxygen in the FOUP is reduced, preventing oxidation of the wafer patterns and deterioration caused by organic substances on the surface while the wafer undergoes manufacturing processes.
Main Environmental Impact Reduction Effects
- Modification of the drive axle (from a servo motor to air cylinder) reduces energy consumption by 36% compared to earlier products.
- An improved purge function reduces purge gas usage by 64% compared to earlier products.
- A modified chamber manufacturing method reduces materials used by 60% compared to earlier products.
(Posted July 26, 2010)