RF Components
Z-match Thin-Film Capacitors for High-Frequency Impedance Matching
TFSQ Series (0402 Size)
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Manufacturing Energy Reduced 75% (Sintering Process) |  |
Dielectric Material Use Reduced 89% |  |
RoHS Compliant |
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Applications
Smart phones, mobile phones, W-LAN units, etc.
By adapting its thin-film technologies established through many years of HDD magnetic head manufacturing to high-frequency components, TDK-EPC created compact, low-profile thin-film capacitors in a minimum 0402 package with excellent characteristics for use in smart phones and other high-performance mobile devices and high-frequency module products. The thin-film processes achieve an extremely tight tolerance (W tolerance: ±0.05 pF), while thin-film materials and optimal designs achieve a Q factor that is 150% higher than existing products (2.2 pF, 2 GHz). The SRF characteristics are outstanding at 6.8 GHz (2.2 pF). As a result of these features, the new capacitors exhibit superior high-frequency characteristics in impedance matching circuits, so the series was named Z-match™.
The terminals located on the bottom surface enable greater dimensional accuracy compared to existing products, allowing for stable and high-precision mounting.
Main Environmental Impact Reduction Effects
- By miniaturizing existing products with the same characteristics (0603 MLCC) to 0402 size, packaging mass has been reduced by 17% and energy consumption in transport can be reduced.
- In the MLCC series, Pd or Ni was used for the inner electrodes, but the new products use Cu for the inner electrodes, reducing rare metals by 85%.
(Posted October 11, 2011)